KNP Web 15,, views · · Colors for Children to Learn With Street Vehicles and Water Slide – Colours Magic Liquids For Kids BinBin. CINETECH > Hard to find / Shortage Pricing, Availability, Datasheet Download, and Product CRJT, CINETECH KNPWJ0R1, CINETECH. Taiwan Wirewound Resistors SQP, KNP is supplied by ☆ Wirewound Resistors Cinetech Ind Co Ltd does not currently advertise comprehensive company.

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Start with the pin at the adjacent corner to the pin already started. Should take 20 – 40 seconds Be sure that the part is aligned and remove the heat. Take note and or mark the PCB so that you will be able to correctly place the part when heating. International Semiconductor International Semiconductor.

Cinetech – Computer and PC Parts Catalog

General Electric General Electric. Quickly remove the iron and using a solder sucker, suck the excess solder from between the pins.

Cambion Cambion CA Step 2 Grab the 14 pin SOP part with very fine tweezers. The amount is learned by trail and error and experience. Continue by flooding the other three rows cihetech pins. Mount the circuit board in a vise that will not burn when heated.

Step 3 Suck any extra solder that is left between the pads and the part.

CINETECH > Hard to find / Shortage Distributor | Uniquip

This method works because sucking only removes the solder between the pins and not the solder between the pad and jnp. Solitron Devices Solitron Devices. Small Outline Package – SO. Do not hesitate contacting: Ruttonsha Associate Ruttonsha Associate.


See datasheet for details. Tecate Group Tecate Group Z Heat the pad with solder and adjust the part so that it lines up with the pads. The guide is organized into different methods. Transys Electronics Transys Electronics.

Use needle-nose pliers to hold the part in place while heating. Step 1 Flood the each row of pins cinetrch solder so that there is one continuous flow across the pins as shown. Do not use the end of the tip or solder will flow from pin to pin.

Edal Industries Edal Industries. Up to WResistance Range: Insert the screwdriver under that side and pry up until the pins are off the PCB and out of the solder. Method 3 – Solder paste Used for: Keep side pressure on the part with fine point needle-node pliers so it will slide off when the solder melts. American Microsemiconductor American Microsemiconductor.

They provide the lowest available TCR of 0. ccinetech

1,5 – Продукция – РКС КОМПОНЕНТЫ

In addition Alpha Electronics has strong capabilities in production of custom products – tailored to your specific needs. Freebird Semiconductor Freebird Semiconductor. Bring the part overtop of the pads, sit the part on top of the pads. Up to 10WResistance Range: This will build up heat on each side and the part will slide off the pads in 5 – 10 seconds.

Without needing the oil baths that conventional standard resistors require, national standard institutes and local calibration laboratories in Japan use our standard resistors both for primary and secondary standards. A simplified list is included with each method to identify which types of SMD components are for the appropriate method.


Bring the part overtop of the pads, slight to one side so that the part can sit flat against the PCB. Our foil resistors and current sensors are used in applications requiring a high degree of precision and stability, such as in medical testing equipment, high performance audio equipment, precision measuring instruments, aerospace, and military applications. The solderings should not look like ’round ball’ on either side of the parts.

Cinetech Computer Hardware Part Catalog

Semiconductor Technology Semiconductor Technology. If this is the cast, there is too much solder being appied to the joint. Diodes, Capacitors and Resistors in sizes like,,and Heat the pad already with solder and slide the part onto the pad so that it is centered between the pads. New Tunirama New Tunirama. Contact the pin and pad at the same time with the conrner of the tip. Step 4 Now solder the other two pins, one-at-a-time.

If there are bridges you will need to reheat the part, remove it, suck the solder from the pads and kjp part, and repeat the procedure with less solder paste.